Oxidation resistance, corrosion protection, and good thermal conductivity are features of this solder remover wire. The tin on the pins can be removed to help prevent short circuits between pins. Using the solder remover wire to clean BGA component pads can improve the success rate during reballing processes. This wire can be used when removing excess solder from pins during IC and component soldering. Precisely braided copper wire provides low residue performance and does not require additional cleaning, making it suitable for pad cleaning. Dimensions are 5cm x 5cm x 2cm. The solder remover wire quickly absorbs a large amount of tin and removes excess solder, ideal for use with various electronics, electrical appliances, and precision instruments. Item Name: Solder Remover Wire Material: Copper Wire Specification: 1.5mm, 2.0mm, 2.5mm, 3.0mm, 3.5mm Cable Length: 1.5m Size Details: 5cm x 5cm x 2cm / 1.97" x 1.97" x 0.79" (Approx.) Notes: Due to differences in lighting and screen settings, the item's color may vary slightly from images. Slight dimensional variations may occur due to manual measurement. Package Includes: 1 x Solder Remover Wire