Durable copper-plated wire construction: the copper-plated wire design resists melting and deformation during repeated use, maintaining shape and heat resistance for safer, more reliable tip cleaning. Flatness retention technology: a durable copper-steel braided mesh preserves the tip’s flatness and thermal contact by removing solder residue efficiently without damaging the tip surface, helping keep heat transfer consistent over time. Extends soldering tip life: controlled, flexible copper-pressing technology reduces abrasive wear while preserving the protective layer on soldering tips, minimizing frequent tip replacement and lowering maintenance cost. High heat resistance and safety: materials and construction are chosen to withstand high temperatures and repeated cleanings, improving operator safety and tool practicality in continuous workflows. Wide compatibility: designed to work with a range of soldering-support tools and tip cleaning stations, this cleaning ball adapts to common electronics repair and assembly setups for broad applicability. Key attributes: Function: quick, effective removal of solder residue and oxidation from soldering iron tips Material: copper-plated wire with copper-steel braided mesh Performance: preserves tip flatness and thermal conductivity, resists deformation, reduces wear Practical applications: Electronics repair bench: quickly clean tips between joints to maintain consistent heat transfer when soldering small components on PCBs. Hobbyist and prototyping work: maintain tip condition during mixed-material soldering and frequent tip changes to keep performance steady. Small-scale production or assembly: use for repetitive soldering runs to reduce tip replacement frequency and maintain process reliability. This cleaning ball is a practical tool to protect soldering tips, maintain consistent heat performance, and reduce downtime from tip wear—compatible with common soldering support equipment used in electronics repair, prototyping, and production.