APPLICATION: 2-sided thermal adhesive tape meets ASTM D5470 with high coefficient for thermal conduction on electronic components, like controller, semiconductor, MOS, IC, GBT, SSD, computer CPU, GPU, RAM & DDR memory modules and so on; easy mountings to replace screws for electronic components to increase the work efficiency, filling gap on uneven surfaces of electronic components for tight fit, holding LED strips and etc. MATERIAL: Double sided thermal conductive tape is a combination of fiber glass that fills conductive ceramic powder for high efficiency and flexibility of thermal conduction & insulation; coated with strong Acrylic adhesive, removable. Used for fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,heat sink and IC chip bonding, high power LED and heat aluminum bonding. FEATURE: Thermal Conductive tape has high thermal conductivity, insulation, strong adhesive, flexibility, compression, high tensile strength to hold the components firmly in place, have the most effective thermal dissipation and widely used in electronic devices. Thermal tape heat conductivity is high and stable, normal temperature 120°C, short-term temperature 180°C. EASY USE: Ideal to mount heat sink to IC chip, fit parts to heating source devices and hold LED strips; clean the dust before application and cut the size as needed, stick and compress the tape, then take off the blue backing film liner by hand to mount another part. The removable property is to allow reposition after application without any damages to components. Avoid finger prints on adhesive layer for strong holding. Specifications: Thickness: 0.2mm Width: 3mm~20mm (your choice) Length: 25M Adhesion: 1.3kg / inch Thermal conductivity: 1.5W / m.K. Breakdown voltage: 4KV Long-term heat resistance: 120 degrees Celsius Short-term heat resistance: 180 ° C Package Included: Double-sided tape*1