Product Description: Ensure precise and reliable soldering with the New Lead-Free Soldering Paste BST-328. This high-quality solder flux cream is designed for PCB, PGA, SMD, and BGA applications, making it an essential tool for chip-level repairs on laptops, computers, mobile phones, and home appliances. Features: 1. Lead-Free Composition: The solder paste is formulated with a lead-free composition (Sn63/Pb37), ensuring compliance with modern environmental standards. 2. Versatile Application: Ideal for SMD IC and BGA IC repairs, this soldering paste is a must-have for maintaining mobile phones and precision equipment. 3. Melting Point: With a melting point of 183C, it provides excellent flow and adherence to create reliable solder joints. 4. User-Friendly Size: Compact and convenient, the size of the solder paste is 37 x 20mm, offering easy handling during application. 5. Easy to Work With: The paste features a white and plump solder joint, minimizing the risk of false welding. It maintains strong adhesion with the solder iron tip. 6. Long-Lasting Viscosity: The solder paste has lasting viscous force, preventing it from drying out quickly during use. Specifications: Model: BST-328 Composition: Sn63/Pb37 Melting Point: 183C Weight: Approx. 50g Package Included: 1 x Solder Paste (BST-328) Enhance your soldering projects with the reliability and convenience of the New Lead-Free Soldering Paste BST-328. Whether you're working on PCBs, PGAs, SMDs, or BGAs, this solder flux cream is a valuable addition to your toolkit. Order now for precise and efficient soldering results.