Grey thermal grease paste Purpose and function: improves heat transfer between a semiconductor die or power device and its heatsink by filling microscopic gaps to form a continuous thermal path. Performance: lowers thermal resistance and enables higher effective thermal conductivity to reduce hot spots during load. Stability and reliability: formulated for stable operation across a wide temperature range with consistent performance over time. Compatibility and packaging: suitable for copper, aluminum, and common heatsink interfaces; available in compact syringes for precise, controlled application. How to apply: apply a thin, even layer on the mating surface, reassemble with the heatsink, and avoid excessive amounts that could squeeze out. Use scenarios: desktop and notebook CPU/GPU cooling upgrades or builds; power electronics or motor controller modules in industrial equipment; power LED lighting modules and automotive lighting installations.