Features: 1.The use of high-performance thixotropic agents can effectively prevent collapse during printing and preheating, and special flux ensures good printing and fine patterns. 2.More advanced insulation technology, long-lasting adhesion, not easy to dry, sticky time up to 48 hours 3., unique formula, perfect performance,easy to weld. 4.The residue is colorless and transparent, does not affect the detection, and has excellent cleaning and cleaning performance. 5.The product has good wettability and strong dry resistance. It has a long shelf life at normal temperature and is suitable for mobile phone repair, computer digital repair industry, high precision circuit board SMT soldering, BGA process soldering, etc. Specification: Size: 35x15mm Weight:40g Melting point: 183 degrees Celsius Composition: Sn63Pb37 Storage: Solder paste is usually refrigerated in a refrigerator. The refrigerating temperature is preferably 5-10 degrees Celsius. Package List: 1x Welding Tin Paste Note: Due to the light and screen setting difference, the item's color may be slightly different from the pictures. Please allow slight dimension difference due to different manual measurement.