5M40ZE64I5N FPGA Chip QFP64 Microcontroller Performance Low Power MAX V 6pcs

This listing contains six units of the 5M40ZE64I5N in a QFP64 package. Key benefits pin count in a compact surfacemount package suitable for complex ICs and dense PCB designs. Standard quad flat package with gullwing leads, supporting reliable soldering and automated SMT assembly. Flexible use for replacements, prototyping, and spare parts due to a sixpiece lot. Clear part identification with model 5M40ZE64I5N to aid traceability and datasheet alignment. Suitable for boards and designs that require a QFP64 footprint, enabling efficient integration of 64 connections in a single package. Key attributes Package: QFP64 Pin count: 64 Package type: Quad Flat Package (QFP) for surfacemount applications Units per : 6 pieces Part number: 5M40ZE64I5N Application focus: compatible with boards and designs that use a 64pin QFP footprint Applications and use cases Replacement on development or production boards that utilize the 5M40ZE64I5N in a QFP64 footprint. Prototyping and design validation for embedded systems requiring a 64pin QFP device. and refurbishment of electronics that use this exact model and package type. Educational or lab environments conducting SMT assembly demonstrations or component testing with QFP64 packages. Notes For exact dimensions, land pattern, soldering parameters, and electrical specifications, refer to the device datasheet and footprint guidelines. Verify board footprint compatibility with the 5M40ZE64I5N QFP64 package before installation.