Feature:1. [Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU.2. [Suitable Model] This BGA reballing template is suitable for S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc. phones.3. [Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners.4. [Precise Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency.5. [Stainless Steel Material] Made from stainless steel, the reballing stencil is high temperature resistant, will not easily deform.Specification:Item Type: BGA Reballing StencilMaterial: Stainless SteelSpacing: 0.12mmApplicable CPU: For Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPUApplicable Models: For S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc..Package List:1 x BGA Reballing Stencil