Designed for DFN8 QFN8 and WSON8 packages Function: Probe line for chip on line data burning with a read write burning needle Pin spacing: 1.27 mm Benefits: Provides precise contact for small package pins during inline programming, enabling reliable read and write of data without introducing excess complexity Compatibility: Suitable for DFN8 QFN8 WSON8 package types in production or development environments Performance attributes: Built to support repeatable contact during data burning and programming tasks Materials: Not specified Applications and use scenarios In line programming on production lines for boards using DFN8 QFN8 or WSON8 packages Firmware or data burning during development, testing, or verification on boards with these package types Reprogramming and data burning in test fixtures or workflows for smallpitch devices Notes Pin spacing 1.27 mm ensures compatibility with tight pitch devices while providing reliable contact for read and write operations