b' Features: Thermalright creates an anti-bend solution for Intel s Lake processors. The LGA1700-BCF, an aluminum frame that replaces the CPU mounting mechanism of company s LGA1700 CPU socket. This frame fits around the processor and is secured with simple screws. The frame applies more even pressure to for Intel s Lake processors, reducing the chance of warping. However, for Intel warns that this mounting solution could your CPU , so consumers should be aware of this. This LGA 1700 Anti-Bend Buckle adopts an all-aluminum CNC gold anodized sandblasting process, with an overall size of 70 x 54 x 6 mm and an overall weight of 55g. Its precise positioning can avoid the capacitors on the motherboard, and uses the original LOTES insulation for protection pads, and also provides different color schemes. Specifications: Name: CPU Anti-Bending Frame Material: aluminum alloy Color: black Size: approx. 53x70x6mm/2.09x2.76x0.24 Applicable: Only provide support for Intel 12th generation CPU, and the chipset is H610 B660 Z690 series Note: Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Please allow 1-2cm measuring deviation due to manual measurement. Package includes: 1 X CPU Bending Corrector 1 X L-shaped Screwdriver'