for MTK CPU RAM PM power Heat TemplateYX

. These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Simple and convenient to use. Item Type: BGA Reballing Stencil Item colour: silver Composition: stainless steel Package includes: 4 x BGA Reballing Stencils The package includes only the items listed above; other products are excluded. Note: Light and different displays may cause the color of the item in the picture a little different from the real thing. Please allow a measurement tolerance of +/- 1-3cm.