The GS8342S18BD250 is a onepiece BGA165 component designed for surfacemount assembly. It provides a 165ball ballgrid array package for dense interconnects in modern electronics. This listing specifies a single piece, ready for use in appropriate boards and assemblies that support a BGA165 footprint. Key benefits density interconnect: 165 balls enable compact routing and strong electrical performance for complex devices. Compact footprint: BGA165 packaging helps save board space while enabling reliable solder joints. Flexible use: Suitable for designs, component replacements, or /rework on boards designed for BGA165 packages. Procurement simplicity: Onepiece quantity per supports singleunit replacements or smallbatch builds. Key attributes Package type: BGA165 Part number: GS8342S18BD250 Quantity: 1 piece Functionality: BGA165 package for surfacem mount integration Compatibility: Intended for boards and assemblies that use a BGA165 footprint; exact footprint match and soldering process must be verified against device requirements Size and dimensions: Not specified in the listing Material: Not specified in the listing Performance characteristics: Not specified in the listing Considerations Exact land pattern, land pad dimensions, and solder ball specifications are not provided in the listing. Confirm compatibility with your PCB design and manufacturing process. Handling and installation should be performed by qualified personnel with proper ESD protection and rework/soldering equipment. Two to three use cases Spare part for electronics : a failed or damaged BGA165 component on a board designed for GS8342S18BD250 to restore functionality. Original equipment manufacturing: Integrate the GS8342S18BD250 into a product that requires a BGA165 package, ensuring footprint and process compatibility. Prototyping and development: Use in development boards or test fixtures that employ a BGA165 package to validate circuit layouts and interconnect performance. Notes This description reflects the model and package type GS8342S18BD250 within a BGA165 configuration. Material, dimensions, and other detailed specifications are not provided here and should be obtained from the official datasheet or supplier documentation for accurate implementation.