- The burn-in socket is constructed to provide safe, precise chip testing and efficient performance during prolonged aging tests. - Designed for electronics manufacturing workshops that perform batch aging tests and for laboratories evaluating chip performance and long-term stability. - Optimizes burn-in socket testing workflows and ensures compatibility with QFP64, LQFP64, and TQFP64 package chips for consistent results. - Enables precise testing and aging of QFP64/LQFP64/TQFP64 chips with a stable base to support reliability and repeatable outcomes. 2-3 practical use scenarios: - In a production line performing batch burn-in tests, the socket enables repeatable, long-duration aging assessments and early fault screening. - In a dedicated test lab, it supports evaluation of long-term stability and performance of QFP64 family devices under accelerated aging conditions. - In R&D, it helps validate multi-package compatibility and streamline integration of burn-in fixtures for QFP64/LQFP64/TQFP64 components.