Features Durable Tin Material: These soldering heat universal stencil balls are made of good quality tin material, stable, durable and can be used for a long time. Connect Chips and PCB: These tin solder balls are used to connect semiconductor chips, circuit modules and PCB boards. Transmit Signals for Welding: Tin solder balls are very small, can transmit electronic signals, very useful for welding work. Enough Quantity: The universal solder heat stencil balls are available in many different sizes, each bottle contains approximately 12,500 solder balls to meet your basic soldering needs. Stable Structure: Tin solder ball for BGA reballing come with stable structure, excellent performance and long service life. Features: Durable Tin Material: These soldering heat universal stencil balls are made of good quality tin material, stable, durable and can be used for a long time. Connect Chips and PCB: These tin solder balls are used to connect semiconductor chips, circuit modules and PCB boards. Transmit Signals for Welding: Tin solder balls are very small, can transmit electronic signals, very useful for welding work. Enough Quantity: The universal solder heat stencil balls are available in many different sizes, each bottle contains approximately 12,500 solder balls to meet your basic soldering needs. Stable Structure: Tin solder ball for BGA reballing come with stable structure, excellent performance and long service life. Specification: Item Type: Tin Solder Ball Material: Tin Specifications: 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6mm Application: Tin balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic signals Package List: 7 Bottles of Tin Solder Ball Package List 7 Bottles of Tin Solder Ball