Half-Cut Design, Precise Alignment: The real machine is measured to ensure accuracy. Each mesh is calibrated according to the original drawings to ensure that every solder joint is not missing; the special chip is half-cut and designed to block the remaining tin to meet different requirements Round and Full: It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips Ultra-thin and Super Tough: Ultra-thin design, better ft of tin planting, continuous bending, and full toughness IP Series CPU Tin Planting Set: Suitable for IP6G/6P/6S/6SP/7G/7P/8G/8P/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max/13/ 13 Mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max High Temperature and Wear Resistance: High-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance, so that each tin point is heated evenly Precision Hole Pitch Design: The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls