Features 1、APPLICABLE MODELS: The reball template is applicable to for Samsung S7 series G9300, 9350, 9308, G930F, etc. Check the model for better fit! 2、FAST TINNING: The tin planting speed is fast, and the reball template will not change under high temperature, so you can take it with confidence! 3、EASY CARRYING: Comes with a compact size and a light weight as well, you can easily store and carry the reball template for convenient use! 4、DEFEND YOUR IC: Multiple IC grooves are set on the main body of the steel mesh by semi etching process to effectively prevent small IC from sticking tin and prevent small IC from breaking corners. 5、STAINLESS STEEL MATERIAL: Made of stainless steel material, the reball template is resistant to rust and corrosion, hard wearing, safe and reliable for long time use. Specification Item Type: BGA Reball Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable Model: For Samsung S7 series G9300, 9350, 9308, G930F, etc. Package List 1 x BGA Reball Stencil