<br>Item type: Low Temperature Tin Paste <br>Material: ABS + solder paste <br>Color: As picture shown <br>Weight: Approx. 44g <br>Model: SFD-231 <br>Ingredients: Sn42/Bi58 <br>Particles: 25-45um (No. 3 powder) <br>Application: mobile phone hard disk CPU IC, etc. <br>Melting point: 138℃ <br>Features: for mobile phone repair1、It has strong continuous printing performance, suitable for welding fine pitch IC and for BGA and relatively precise components. <br>2、Good wettability and mold release, cold collapse resistance, hot collapse resistance, strong dry resistance. <br>3、Suitable for PCB welding of many high-required materials, fine pitch and high-precision components, and there is little displacement problem of even tin tombstone. <br>4、Tin is full and bright, tin beads, little residue, white and transparent, no fluorine and other highly corrosive substances. <br>5、Professional manufacturing, stable performance and high reliability.1 x <br> <br>Low Temperature Tin Paste&nbsp;&nbsp;&nbsp;