1. New ID design upgrade 2. G0 series MCU- STM32G0B1RET6 3. Heat sink design upgrade, increase the heat dissipation area, greatly the heat dissipation performance 4. Increase the fan that can control the heat dissipation of the device to lower the temperature of the device 5. Increase the thermistor interface protection circuit to prevent burning of the master control chip Colour:black :plastic Size:103.75 x 70.25mm Package Contents: 1 * SKR MINI E3 V3.0 3D Motherboard Only the above package content, other products are not included. Note: Light reflection and different displays may cause the color of the item in the a little different from the real thing. The measurement allowed error is +/- 1-3cm.