Features: 1.Thermal inertia of the semiconductor cooler is very small, and cooling and heating time is very fast. When hot end has good heat dissipation and the cold end is empty, the cooling fin can up to the maximum temperature difference in less than one minute. 2.Can both refrigerate and heat. The refrigeration efficiency is generally 55?60%, but the heating efficiency is always higher than 1. Using a single piece can replace the separate refrigeration system and heating system. 3.No need for any refrigerant, can work continuously, no pollution source, no rotating parts, no rotation effect. 4.There are no sliding parts, no vibration or noise when working, long life and easy installation. 5.A current transducer type piece. Through control of input current, high?accuracy temperature control can be realized. With temperature detection and control means, remote control, program control, and computer control are realized to form an automatic control system. 6.The reverse use of semiconductor refrigeration fins is thermoelectric power generation. Semiconductor refrigeration fins are generally suitable for power generation in the middle and low temperature areas. 7.The power of a single refrigeration component pair of a semiconductor refrigeration chip is very small, but it is combined into electric pile, and the same type of electric pile is used in series and parallel to form a refrigeration system, the power can be very large, so the cooling power can be several The range of milliwatts to tens of thousands of watts. 8.Temperature resistance of the semi?conductor refrigeration sheet is 80 for normal temperature hot side, 150 for medium temperature hot side, and 200 for high temperature hot side; the temperature difference between the hot side and the cold side can up to 67 in the first stage, and 80 in the second stage. The third level reaches 90, and the fourth level reaches 107. specification:Item Type: Thermoelectric Cooler Material: Ceramic Model: TES1-06305 Rated Voltage: DC6V Maximum Voltage: DC7.43V (Th=30) Maximum Current: 5A (U=7.43V, Th=30) Maximum Temperature Difference: 66C (Qc=0,Th=30C) Maximum Cooling Capacity: 21W (T=0,Th=30) Internal Resistance: 1-1.25 Lead : 22AWG, L=150mm Packaging Process: 704 Silicone Rubber Sealing Assembly Pressure: 4kg Working Temperature: -50-+80 Storage Temperature: -40-+60 Size: Approx. 15x30mm / 0.6x1.2in Application Range: 1. Applications in high-tech fields: satellites, semiconductor lasers, infrared thermal imaging, infrared detectors, optoelectronic devices, etc. 2. Home appliance applications: dehumidifiers, portable heating and cooling boxes, hot and cold water dispensers, cold drink cups, beverage wine coolers, etc. 3. Application in electronic technology: cooling of electronic equipment, electronic components, computers, etc. 4. Industrial applications: automobile refrigerators, small air conditioners, dehumidifiers, thermostats, petroleum testing instruments, etc. 5. Medicine, agricultural and biological applications: physical cooling pads, semiconductor physiological slices, vaccine preservation, etc. PackageList:1 x Cool Plate Module Note1. Please allow 0?1 inch error due to manual measurement. Thanks for your understanding. 2. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.