Features: Superior Gaps Filling: for uneven surfaces, our thermal putty eliminates air gaps and voids between CPU/GPU chips and heatsinks, ensuring perfectly heat transfer even. Thermal Conductivity: With exceptionally 11.5 W/m·K thermal conductivity rating, this putty efficiently transfers heat from processors to cooling, ideal for overclocking, high end GPUs, and data center hardware. Effortless Installation Process: Simply tearing off the required amount, put into shape, and place on the chip center for complete coverage without messy application tools or precise measurements. Long Term Stability: Resists drying out, performances degradation even under extreme temperature fluctuations, maintaining reliabled thermal performances for easy to operate over extended periods. Wide Compatibility: for laptops, gaming consoles, graphics cards (VRAM/GDDR6X), servers, and any hardware with exposed chips or challenging surfaces irregularities, outperforming traditional thermal pastes and pad. Specifications: Component: silicone grease Size: 8.7×7.2×4.7cm/3.23x2.83x1.57in versions: basic version, intermediate version, advanced version Optional Package Includes: 1Set PUTTY Thermal conductivity Silicone Grease note: Please allow 1-2cm errors due to manual measurement. Pictures may not reflect actual color due to different monitors.