Designed for DFN8, QFN8 and WSON8 devices - Functionality: Probe line for chip on-line burning data, with read and write burning needle capability - Compatibility: Suitable for DFN8, QFN8, and WSON8 package types - Size and pitch: Pin spacing 1.27 mm for accurate alignment with device pads - Purpose: Supports on-line programming and data burning during manufacturing, and enables reliable read/write operations - Performance: Provides precise probe contact to facilitate data loading and verification on multi-package ICs Practical use scenarios - On-line programming during PCB assembly: Program firmware or data into DFN8/QFN8/WSON8 ICs on the production line using the probe line for burning data - Data verification in burn-in testing: Read and write test data to verify device functionality and data integrity during burn-in - Development and debugging: Use in R&D or test fixtures to probe, load, and verify firmware on sample DFN8/QFN8/WSON8 devices with 1.27 mm pitch Note: Material details are not specified; design focuses on compatibility, function, size, and performance for on-line burning and data read/write operations.